Hardware Product Management
V-model product lifecycle from discovery to end-of-life — managed with gate reviews, BOM risk analysis, and full EU regulatory traceability. We navigate CRA, AI Act, CBAM, and Ecodesign so you ship on time.
Why Inovasense
Hardware product management in 2026 means navigating a regulatory landscape that didn't exist three years ago. The EU Cyber Resilience Act mandates vulnerability handling and SBOMs. The AI Act classifies your edge inference module. CBAM adds carbon cost to your BOM. We manage all of this — from the first requirements workshop to volume production — so your engineering team focuses on the product, not the paperwork.
Product Lifecycle Phases
Discovery & Requirements Engineering
Structured requirements capture with full traceability (DOORS/Jira). Technology trade studies with quantified criteria — BOM cost, power budget, certification scope, supply chain risk.
Architecture & Design
V-model development with CR→DR→PR gate reviews. Schematic and PCB design in Altium Designer with dual-source BOM strategy. Design FMEA and worst-case analysis before first spin.
Prototype & Validation
First prototype in 4–8 weeks from requirements sign-off. Pre-compliance EMC screening to catch issues before €3K–8K lab visits. DV/PV testing against qualification matrix.
Certification & Compliance
Full CE marking: EMC (EN 55032/55035), Safety (EN 62368-1), RED (EN 300 328/220). EU Cyber Resilience Act (2024/2847) readiness. AI Act classification for edge computing products.
NPI & Volume Production
New Product Introduction with PPAP, first article inspection, and EOL test fixture qualification. DFM/DFA reviews with EMS partner. IPC Class 2/3 workmanship. Production yield tracking (target >95% first-pass).
Sustaining & End-of-Life
Post-launch firmware updates (OTA), field failure analysis, and component obsolescence management. EU Right-to-Repair compliance. Planned EOL with last-time-buy strategy and customer migration path.
2026 Regulatory Landscape
The EU regulatory environment for electronics is the most complex it has ever been. We track and integrate compliance for all of these into your product lifecycle.
EU Cyber Resilience Act
Mandatory 2027EU 2024/2847
Vulnerability handling, SBOM, 5-year security updates for all connected products.
EU AI Act
Phased 2025–2027EU 2024/1689
Risk classification for products with embedded AI/ML inference at the edge.
CBAM
Active 2026EU 2023/956
Carbon Border Adjustment Mechanism — carbon cost reporting for imported components.
EU Chips Act
ActiveEU 2023/1781
Supply chain resilience, semiconductor sovereignty, and crisis monitoring obligations.
Ecodesign (ESPR)
Phased 2025–2030EU 2024/1781
Digital Product Passport, repairability scoring, and recycled content mandates.
RED Delegated Act
Mandatory Aug 2025EU 2022/30
Cybersecurity baseline for all radio equipment — authentication, secure boot, update mechanisms.
Our Methodology
Development Framework
Verification and validation at every level — from component to system. Each design phase has a corresponding test phase with pass/fail criteria defined upfront.
Milestone Reviews
CR→DR→PR→DV→PV reviews with mandatory sign-off criteria. No phase proceeds without documented gate approval. Budget and timeline re-baselined at each gate.
Risk Quantification
Design FMEA, Process FMEA, and BOM risk matrix maintained as living documents. Risk priority numbers (RPN) drive design decisions and supply chain strategy.
Technical Domains We Manage
FPGA & Custom Silicon
Management of complex RTL verification and DO-254 DAL-B certification cycles. We leverage Native Rad-Hard (NanoXplore) and ASIL-D COTS Assurance (ST/NXP).
Embedded Security
Security-by-design implementation using CC EAL6+ certified secure elements (STSAFE-A110, EdgeLock SE050) for CRA and NIS2 compliance.
Edge AI & Sensing
Managing data collection, model training, and EU AI Act conformity assessment.
Start with a Requirements Workshop
NDA-first engagement. 2–3 day structured workshop to define requirements, identify regulatory scope (CRA, AI Act, RED), and produce a budgeted project plan — before any engineering commitment.